UTEP partners with DoD and NSA on semiconductor initiative
The University of Texas at El Paso will do its part to "strengthen the nation's leadership" in microchip technology after it struck a partnership with two federal agencies.
UTEP on Friday announced it will collaborate with the Department of Defense (DoD) and the National Security Agency (NSA) on an initiative that supports "research and training to strengthen the nation's leadership in semiconductor, or microchips, technology," the university said in a statement.
Meanwhile, UTEP also became one of 11 universities nationwide to hold all three NSA Center of Excellence designations, after the federal administration named it an NSA Center of Academic Excellence in Cybersecurity Research.
The school had previously been named an NSA Center of Excellence for cybersecurity defense and cybersecurity operations.
"We are deepening our relationship with the nation's premier cybersecurity agency," said UTEP President Heather Wilson. "In both computer science and electrical and computer engineering, UTEP conducts exceptional research and develops talented students. We will build on this."
Working in line with a federal initiative dubbedScalable Asymmetric Lifecycle Engagement, or SCALE, UTEP students and faculty will conduct microelectronics research in physics, engineering, materials science and cybersecurity.
According to UTEP, its participation in SCALE will help students serve the defense industry's microelectronics workforce after graduation.
"The DoD and NSA require a semiconductor-savvy workforce who can pair expertise in microelectronics design and manufacturing with right-sized cybersecurity protections," said Meredith Dyck, Ph.D., chief strategist for microelectronics at NSA. "By collaborating with UTEP, we aim to create a pipeline of exceptional graduates who are poised to tackle the most challenging national security problems. Today's event is a significant step in the right direction."
UTEP said its initial semiconductor research will focus on making 3D-printed microchips capable of higher performance at a reduced cost.
"A big trend in the industry is, how do we pack more and more capabilities onto one chip? Can we combine more complicated parts into a single package to make things faster, better, and cheaper?" said Robert C. Roberts, Ph.D., assistant professor in the Department of Electrical and Computer Engineering at UTEP. "This is a pivotal research area in the semiconductor technology industry."
